The CCD485 butted device is an assembly consisting of two CCD485s aligned on a single ceramic substrate, with two separate fiber optic faceplates and a single scintillator (not in picture) attached. The CCD chip utilizes a "full frame" architecture and was designed for high resolution scientific, medical and industrial applications. The CCD is organized as an array of 4096 horizontal by 4097 vertical imaging elements. The pixel pitch and spacing is 15µm with near 100% fill factor. The imaging area may be operated in either buried channel or Multi-Pinned Phase (MPP) modes. Three-phase clocking is employed in the imaging area. The imaging area is divided into four quadrants. Each quadrant may be clocked independently if desired. The CCD485 may be clocked such that the full array is read out from any one of the four output amplifiers. The fiber optic faceplate is a tapered design which virtually eliminated the butted imaging edge. This device demonstrates Fairchild Imaging's large focal plane array butting capability. The fiber optic faceplate and scintillator is attached to the top of the CCD for high resolution X-ray applications.

2 - 4096 x 4097 Photosite Arrays 15µm x 15µm Pixel Size 61.20 x 61.21mm Image Area 4080 x 4080 Optically Active Pixels Full Frame Imager Multi-Pinned Phase (MPP) Option Wide Dynamic Range Three phase buried channel NMOS Fiber Optic Faceplate Scintillator (not shown)

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