The CCD296 assembly is a series of sensors, consisting of three or four end-to-end butted CCD chips, ceramic substrate, fiber optic faceplate and scintillator. The CCD chip utilizes a “time delay integration” (TDI) and/or full frame imager (in the staring mode) architecture and was designed specifically for scanning x-ray imaging applications. The design of this CCD is a 1024 x 48, 45µm pixel pitch. The CCD is butted end-to-end with a 90µm gap between each die. A single fiber optic faceplate and scintillator is attached to the top of the CCD for high-resolution x-ray applications.

4096 x 132 pixel array. 4-chip hybrid 45µm x 45µm pixel size 184.59 x 5.94mm active area Time delay integration (TDI) full frame imager ("staring") modes 4 output ports (1 port per die) Multi-pinned phase (MPP) Four-phase buried channel NMOS Fiber optic faceplate Scintillator

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