DUTIES: Take on role of NPI (new product introduction) liaison between design engineering and manufacturing.  Assist engineering in qualifying technical design, test and user documentation for release.  Assist design engineering in the development, test and debug of new products.  Assist mfg traveler and build/test instruction development for new products.  Assist MFG in the trouble-shooting and FA of release products.  Prepare and present reports and presentations to peers and management.

EXPERIENCE: Minimum of 5 years experience in product or electrical engineering.  Familiar and experience with:  PCB design CAD systems / Embedded systems and high speed electrical design with hands on debug experience.  Engineering and manufacturing documentation needs and the ECO release process structure.  RTL, C, C++ programming experience a plus.  General use of electrical test equipment such as o’scopes, DVMs, Logic analyzers, etc.  Familiarity with cameras and imaging systems a plus. 

EDUCATION: BSEE minimum, MSEE preferred

DUTIES: Responsible for evaluation of silicon test structures, CMOS image sensors and scientific cameras.  Designing and developing experimental setups based on existing or non-existing methods; performing various performance analysis and testing; analyzing measurement result; writing test procedures and technical reports; participate in multiple team project activities to ensure the timely completion of deadlines.

EXPERIENCE: Indepth knowledge of semiconductor physics, specifically CMOS imagers.  Knowledge of pixel operation from both optical and electrical perspective.  Hands-on experience with Matlab programming and data analysis techniques, experience with design, development, performing, and validation of setups for: image sensor characterization at the wafer level, with accent on pixel performance characteristics / low noise amplifiers / precision ADC.  Mixed signal, low noise circuit design experience.  Hands-on experience with manual probe stations and probe card design, Lab test equipment (Function Generator, Spectrum Analyzer, Data Acquisition units) etc.  Hands-on experience with automated data collection and statistical data analysis tools.  Good teamwork with strong communication and presentation abilities. 

The following will be considered as a plus:  Automated test experience with Teradyne IP750, LabView programming and good understanding of Imaging Systems and Image Sensor Architecture.

EDUCATION: BS or MS in Image Processing, Electrical / Optical Engineering with 3+ years industrial experience required.

DUTIES: Sustain thin films manufacturing areas, both in-house and at various support foundries.  Develop new processes for optical coatings and vertical interconnections, and support process integration for new products, as well as those for yield and performance improvement on existing products.

EXPERIENCE: 10 years minimum PVD optical thin film properties and process engineering experience required.  Familiarity with ALD optical thin films, and deposition equipment highly desirable.  Experience with PECVD processes is a plus.

EDUCATION: MS in applied physics or equivalent

DUTIES: Responsible for developing advanced CMOS image sensor circuits and technologies requiring design and optimization of various analog and digital circuits by conducting extensive circuit simulations.  Ability to work with a team of engineers to design and optimize the circuits from the pixel output to the ADC output.  Responsible for the layout and providing direction to design layout professionals on completing the design.

EXPERIENCE: 5+ years experience in CMOS digital and analog techniques.  Knowledge of design techniques for op-amps, reference sources (both current & voltage), analog to digital converters, digital to analog converters.  Working understanding of device physics and analog layout issues for good matching, low offset amplifiers, and low noise designs.  Working knowledge of Cadence & Mentor Graphics Design tools.  Knowledge and experience in Verilog a must.  Ability to perform physical transistor level layout.  Knowledge of analog simulators and simulation techniques.  Additional desired qualifications:  Design experience on amplifiers, bandgap, switched-capacitor circuits, PLL, ADC, & DAC.  CMOS image sensor column readout circuit and low-noise circuit design experience is a plus.  Knowledge of high-level hardware description language (Verilog).  Experience in system modeling in Matlab is a plus.

EDUCATION: Ph.D. or Master degree in electronics with 5 years experience in advanced circuit design.

DUTIES: Responsible for yield, performance, and reliability enhancements, and the associated process integration on CMOS products at various foundries.  Performs various failure analyses on products as well as electrical parametric testing and characterization on test structures, circuits, and devices, in-process or post-fab.  Supports Design and Test Engineering departments, and packaging development efforts, as well as process integration efforts at various foundries.  Must be willing and able to travel, and be on travel, abroad if necessary, for as long as two weeks at a time.

EXPERIENCE: 5 years minimum CMOS process integration, yield, and reliability engineering experience is required.  Familiarity with 0.18/.013 micron CMOS imager process architectures, product engineering, and foundry support is greatly preferred.

EDUCATION: MS in Electrical Engineering, Material Science, or equivalent

DUTIES: Design advanced digital control blocks in image sensors, develop detailed and comprehensive test plans, verification test benches and perform debugging tests, STA, Verilog modeling, simulation, physical place & route, timing closure. Work closely with analog sensor design team to ensure full design compatibility and specification compliance. Fully document design description, specifications and communicate all requirements to sensor design team. Develop digital design and verification infrastructure including tool selection and setup. Participate in review of design verification coding and coverage metrics. Complete assignments within defined project deadlines and goals. Support product development and product support related tasks including customer support documentation.

EXPERIENCE: 6 or more years of digital IC design & verification experience. Demonstrated working experience in design verification and test bench development. Working knowledge of IC verification tools, scripting and programming languages. Experience required in RTL coding, verification, gate level simulation, and associated tools. Experience in physical design, place and route, static timing analysis (STA) is a plus. Must be fluent in Verilog.

EDUCATION: BS or MS in Electrical Engineering or related field.