Fairchild Imaging develops and manufactures solid-state electronic imaging components, cameras, and systems. We have a long history of pioneering imaging technology from the first practical aeronautical camera to the first commercially available CCD. Our growth plans call for us to expand our team to address the market demand for products in Medical, Scientific, Aeronautical and Industrial segments.

We are looking for experienced and talented System Design Engineers to join our team of world class camera designers. As a system design engineer the candidate will have the opportunity to develop various technologies in different aspects of our camera products from embedded system programming to circuit level design and simulations. A successful applicant would have experience in some of the following areas:

• System level architecture & design
• Digital design for FPGA implementation
• Analog circuit design for power supply, bias generation etc.
• High speed PCB analysis and design for signal integrity and impedance matching
• Tools including OrCad/Altium/Allegro, ModelSim, Quartus, Libero, Xilinx ISE, Synplicity, Ansoft Designer, SPICE, Matlab, Visual Studio, Keil.
• Experience with test equipment such as Oscilloscopes, Logic Analyzers, Vector Network Analyzers, Pattern Generators etc.

DUTIES:

• System level architecture and design
• RTL coding of control logic and image processing logic
• Verification of digital circuit designs
• Implementation of digital designs in FPGAs
• Component level schematic design & simulation
• Basic analog circuit design for power/bias generation
• Design documentation and project planning

In addition the candidate must have:

• Strong written and oral communication skills
• Strong team player
• Experience in Telecommunications or Imaging fields a strong plus.
• US Citizenship or Permanent Resident status.
• BSEE/MSEE with 6+ years of experience.

JOB DUTIES: The candidate will be required to design assembly fixtures, develop and document processes, analyze and correct failure trends. The candidate will specify suitable materials and processes such as adhesives, die-attach, wire bonding, finishes, labeling, packaging, testing needs, and quality for Electro/Optical assemblies. You will develop and validate new processes and be required to document them as well as train operators.  You will need to be a self-starter and be able work in a self-directed mode. 

EXPERIENCE: 5+ years of recent experience as a manufacturing engineer in Electro/Optical assemblies.  Semiconductor Industry experience with wafers, die, wire bonding, die placement, automation, adhesives, failure analysis, and yield enhancement is required.  Must have good manual dexterity skills to participate in R&D and prototyping efforts.  Must be able to demonstrate excellent written and verbal skills and must be able to present information and assignment status in front of groups.  Experience with CCD and CMOS sensor test and assembly is desired.  ISO 9001 knowledge is required.  US Citizenship.

QUALITY KNOWLEDGE: Must have strong working knowledge of the requirements contained within ISO 9001. Desirable to have a  working knowledge of the requirements contained within FDA QS-Rs, Mil-Std-883 and ISO13485. Participate in the creation of FEMAs and their speedy resolution. Support risk/ hazard analysis efforts as prescribed in ISO 14971/ IEC 60601-1 / UL 60601-1 and IEC 60601-1-1-4 and familiarity with UL. 

EDUCATION:  BS Mechanical or BS Electrical Engineering. Experienced with SolidWorks modeling or equivalent.

JOB DUTIES: Responsible for developing advanced CMOS image sensor circuits and technologies requiring design and optimization of various analog and digital circuits by conducting extensive circuit simulations.  Ability to work with a team of engineers to design and optimize the circuits from the pixel output to the ADC output.  Responsible for the layout and providing direction to design layout professionals on completing the design.

EXPERIENCE: 5+ years experience in CMOS digital and analog design techniques.  Knowledge of design techniques for op-amps, reference sources (both current & voltage), analog to digital converters, digital to analog converters.  Working understanding of device physics and analog layout issues for good matching, low offset amplifiers, and low noise designs.  Working knowledge of Cadence & Mentor Graphics Design tools.  Knowledge and experience in Verilog a must.  Ability to perform physical transistor level layout.  Knowledge of analog simulators and simulation techniques.  Additional desired qualifications:  Design experience on amplifiers, bandgap, switched-capacitor circuits, PLL, ADC, and DAC.  CMOS image sensor column readout circuit and low-noise circuit design experience is a plus.  Knowledge of high-level hardware description language (Verilog).  Experience in system modeling in Matlab is a plus.

EDUCATION: PhD or Master’s Degree in electronics with 5+ years experience in advanced circuit design.

Fairchild Imaging develops and manufactures solid-state electronic imaging components, cameras, and systems. We have a long history of pioneering imaging technology from the first practical aeronautical camera to the first commercially available CCD. Our growth plans call for us to expand our team to address the market demand for products in Medical, Scientific, Aeronautical and Industrial segments.

We are looking for Junior System Design Engineers to join our team of world class camera designers. As a system design engineer the candidate will have the opportunity to develop various technologies in different aspects of our camera products from embedded system programming to circuit level design and simulations. A successful applicant would have experience in some of the following areas:

• Digital design for FPGA implementation.
• Analog circuit design for power supply, bias generation etc.
• Tools including OrCad/Altium/Allegro, ModelSim, Quartus, Libero, Xilinx ISE, Synplicity, Ansoft Designer, SPICE, Matlab, Visual Studio, Keil.
• Experience with test equipment such as Oscilloscopes, Logic Analyzers, Vector Network Analyzers, Pattern Generators etc.

In addition the candidate must have:

• Strong written and oral communication skills.
• US Citizenship or Permanent Resident status.
• BSEE/MSEE with 0 to 3 years of experience.

Duties:

RTL coding of control logic and image processing logic

Verification of digital circuit designs

Implementation of digital designs in FPGAs

Component level schematic design & simulation

Basic analog circuit design for power/bias generation

Design documentation

DUTIES: Responsible for yield, performance, and reliability enhancements, and the associated process integration on CMOS products at various foundries.  Performs various failure analyses on products as well as electrical parametric testing and characterization on test structures, circuits, and devices, in-process or post-fab.  Supports Design and Test Engineering departments, and packaging development efforts, as well as process integration efforts at various foundries.  Must be willing and able to travel, and be on travel, abroad if necessary, for as long as two weeks at a time.

EXPERIENCE: 5 years minimum CMOS process integration, yield, and reliability engineering experience is required.  Familiarity with 0.18/0.13 micron CMOS imager process architectures, product engineering, and foundry support is greatly preferred.

EDUCATION: MS in EE, Material Science or equivalent