Welcome to Fairchild Imaging Careers at Fairchild Imaging
Silicon Wafer
Careers

Located in Milpitas, California, in the heart of the Silicon Valley, Fairchild Imaging is a pioneer in the CCD industry.

We recognize our products are only as good as our people who develop them. We are therefore looking for passionate, innovative people who enjoy the challenges of technology.

We offer competitive salaries, outstanding benefits, a 9/80 work schedule and a fun and creative working environment.

If you are looking for a career that offers challenging, diverse opportunities and the possiblity of creating the scientific and technological advances of the 21st century, explore our job listing and send your resume today.

Please fax your resume to (408) 435-8259 or e-mail to hr@fcimg.com.

U.S. Citizenship or permanent residency required.  Fairchild Imaging is an equal opportunity employer.

Currently open positions at Fairchild Imaging:

 
SENIOR MANUFACTURING MECHANICAL ENGINEER  

JOB DUTIES: The candidate will be required to design assembly fixtures, develop and document processes, analyze and correct failure trends. The candidate will specify suitable materials and processes such as adhesives, die-attach, wire bonding, finishes, labeling, packaging, testing needs, and quality for Electro/Optical assemblies. You will develop and validate new processes and be required to document them as well as train operators.  You will need to be a self-starter and be able work in a self-directed mode. 

EXPERIENCE: 5+ years of recent experience as a manufacturing engineer in Electro/Optical assemblies.  Semiconductor Industry experience with wafers, die, wire bonding, die placement, automation, adhesives, failure analysis, and yield enhancement is required.  Must have good manual dexterity skills to participate in R&D and prototyping efforts.  Must be able to demonstrate excellent written and verbal skills and must be able to present information and assignment status in front of groups.  Experience with CCD and CMOS sensor test and assembly is desired.  ISO 9001 knowledge is required.  US Citizenship.

QUALITY KNOWLEDGE: Must have strong working knowledge of the requirements contained within ISO 9001. Desirable to have a  working knowledge of the requirements contained within FDA QS-Rs, Mil-Std-883 and ISO13485. Participate in the creation of FEMAs and their speedy resolution. Support risk/ hazard analysis efforts as prescribed in ISO 14971/ IEC 60601-1 / UL 60601-1 and IEC 60601-1-1-4 and familiarity with UL. 

EDUCATION:  BS Mechanical or BS Electrical Engineering. Experienced with SolidWorks modeling or equivalent.

     
SR. IMAGE SENSOR DESIGN ENGINEER  

JOB DUTIES: Responsible for developing advanced CMOS image sensor circuits and technologies requiring design and optimization of various analog and digital circuits by conducting extensive circuit simulations.  Ability to work with a team of engineers to design and optimize the circuits from the pixel output to the ADC output.  Responsible for the layout and providing direction to design layout professionals on completing the design.

EXPERIENCE: 5+ years experience in CMOS digital and analog design techniques.  Knowledge of design techniques for op-amps, reference sources (both current & voltage), analog to digital converters, digital to analog converters.  Working understanding of device physics and analog layout issues for good matching, low offset amplifiers, and low noise designs.  Working knowledge of Cadence & Mentor Graphics Design tools.  Knowledge and experience in Verilog a must.  Ability to perform physical transistor level layout.  Knowledge of analog simulators and simulation techniques.  Additional desired qualifications:  Design experience on amplifiers, bandgap, switched-capacitor circuits, PLL, ADC, and DAC.  CMOS image sensor column readout circuit and low-noise circuit design experience is a plus.  Knowledge of high-level hardware description language (Verilog).  Experience in system modeling in Matlab is a plus.

EDUCATION: PhD or Master’s Degree in electronics with 5+ years experience in advanced circuit design.

     
SR. HARDWARE DESIGN ENGINEER  

DUTIES: System level architecture and design; component level schematic design and simulation; board level analog circuit design; board level design; low noise design for electronics; and design documentation and project planning.

EXPERIENCE: 6+ years of industry experience of the design of electronic systems. Experiences shall include: System level architecture and design, Analog Circuit design, Board Level design, Low noise electronics. Experience with test equipment such as Oscilloscopes , Logic analyzers, Vector Network analyzers, Pattern Generators, etc.

EDUCATION: BS/MS EE or similar

     
SR. SYSTEM DESIGN ENGINEER  

DUTIES: RTL coding of control logic and image processing logic. Verification of digital circuit designs. Component level schematic design and simulation. Implementation of digital designs in FPGAs. Basic analog circuit design for power/bias generation. Design documentation. In addition the candidate must have: Strong written and oral communication skills. Strong team player and experience in Telecommunications or imaging fields a strong plus.

EXPERIENCE: 6+ years experience. System level architecture and design, digital design for FPGA implementation, analog circuit design for power supply, bias generation etc. High speed PCB analysis and design for signal integrity and impedance matching. Tools including OrCad/Altuim/Allegro, ModelSim, Quartus, Libero, Xilinx ISE, Synplicity, Ansoft Designer, SPICE, Matlab, Visual Studio, Keil. Experience with test equipment such as Oscilloscopes, Logic analyzers, Vector Network Analyzers, Pattern Generators, etc.

EDUCATION: BSEE / MSEE

     
PROGRAM MANAGER  

DUTIES: Through demonstration of technical experience and personal initiative, take charge and oversee implementation and execution of CCD and/or CMOS based development programs, including the transition to production.  Key responsibilities include project planning and directing a matrix organization to meet schedule, cost, and performance objectives for assigned programs.  Customer development and satisfaction, while representing Fairchild Imaging in a professional, competent manner, are primary expectations.

EXPERIENCE: Requires prior Project Management experience, good communications skills, the ability to balance technical solutions with cost and schedule factors, and demonstrate initiative and leadership.  Knowledge of business acquisition, contract, finance, and engineering are fundamental.

EDUCATION: BS in Engineering or a related field is required.  (BSME or BSEE preferred)

     
SR. DIGITAL DESIGN & VERIFICATION ENGINEER  

DUTIES: Design advanced digital control blocks and develop detailed and comprehensive test plans, verification test benches, and perform debugging tests, STA, Verilog modeling, simulation, physical place & route, timing closure optimization. Work closely with sensor design engineers to ensure design quality and specification compliance. Develop verification infrastructure. Participate in reviews of design verification coding and coverage metrics. Complete assignments within defined project deadlines and goals.
Support product development related tasks defined by Camera & Test engineering

EXPERIENCE: 6 or more years of IC design verification experience. Demonstrated working experience in design verification and test bench development. Working knowledge of IC verification tools, scripting and programming languages. Experience required in RTL coding, verification, gate level simulation, and associated tools. Experience in physical design, place and route, static timing analysis (STA) is a plus.
Must be fluent in Verilog.

EDUCATION: BS or MS in Electrical Engineering or related field

     
SR. HARDWARE DESIGN ENGINEER  

DUTIES: System level architecture and design; component level schematic design and simulation; PCB design/guidance; board level design; low noise design for electronics; and design documentation and project planning.

EXPERIENCE: 6+ years of industry experience of the design of electronic systems. Suitable candidates would have experience in some of the following areas: System level architecture and design; system level circuit design for low noise circuitry including power supply/ biasing/ ADC/DAC; Advanced PCB fabrication technologies; USB and other high speed signaling protocols;  Use of test equipment such as Oscilloscopes , Logic analyzers, Vector Network analyzers, Pattern Generators, etc.

EDUCATION: BS/MS EE or similar

     
SR. SYSTEM DESIGN ENGINEER  

DUTIES: System level architecture and design; Embedded system design; RTL coding of control logic and image processing logic; u-controller programming; Verification of digital circuit designs; Implementation of digital designs in FPGAs; Design bring-up and debug; Design documentation.  In addition the candidate must have: Strong written and oral communication, time management and team participation skills.

EXPERIENCE: 6+ years industry experience in the design of digital systems. Suitable candidates would have experience in some of the following areas: System level architecture and design; digital design for FPGA implementation; C/C++/C# programming; Scripting languages such as Perl/Python/Tcl etc; Tools including ModelSim, Quartus, Libero, Xilinx ISE, Synplicity, Matlab, Visual Studio, Keil. Experience with test equipment such as Oscilloscopes, Logic analyzers, Vector Network Analyzers, Pattern Generators, etc; Experience in Telecommunications or imaging fields a strong plus.

EDUCATION: BSEE / MSEE

 

Thank you for your interest in Fairchild Imaging.

 
Back To Top
Content © Fairchild Imaging. Technology & Design © T324 : Web Sites - Hosting - Marketing - Technology  All Rights Reserved.